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22nd International exhibition of electronic components, modules and systems
15-17 April 2019, Moscow, Crocus Expo, Pavilion 3, halls 12,13

News

Category:News Press release
News

Nordson EFD will share Ratio-Pak® cartridge systems

Nordson EFD will share Ratio-Pak® cartridge systems offer a versatile solution to package a variety of two-part materials, including foams, coatings, potting compounds, and other adhesives and sealants.

News

Nordson EFD will introduce Liquidyn® P-Jet SolderPlus® - a high performance jet valve system

Nordson EFD will introduce Liquidyn® P-Jet SolderPlus®, which is a high performance jet valve system designed for the non-contact micro-dispensing of Nordson EFD SolderPlus® solder paste and filled products. The Liquidyn P-Jet SolderPlus valve can produce micro-deposits as small as 700µm at dispensing frequencies of up to 25Hz, for a faster production process. The valve can also dispense larger fluid volumes and is capable of both dot and line dispensing.

News

On behalf of the company ITE Expo and team of exhibitions ExpoElectronica and ElectronTechExpo we congratulate on the 20th anniversary our long-time partner Elint SP! It is an honor and a great pleasure for us to work with such professionals of your business as your company. Let all the best that has already been done by us, will be further developed, and new business and undertakings are accompanied by luck and stability.

News

SM-COMPLECT

Welcome new exhibitor of ExpoElectronica 2018 - SM-COMPLECT - specialist in the distribution of electronic components, modules and other materials for use in highly complex applications

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